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In 1993 Microvection employees created a line of high performance water-cooled copper micro-impingement heat sinks for high power electronics and laser diodes. These micro-impingement coolers, with channels as narrow as 1.25 microns, offered unparalleled thermal efficiency, providing extremely low thermal resistances (as low as 20 K-cm^2/kW) at very modest pumping powers. Since that time, additional research has been conducted into various areas to improve or supplement the performance of the original design. These areas include:
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